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OmniEtch
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SYSTEM SPECIFICATION -
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gUser
Selectable Etch Time, Etch Temperature, variable Etch Speed
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g36--6
Carrier Medium is compatible with all Acid and Base Etch Chemistries
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gDouble
containment system for all Etchant
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Minimal Consumption of
Etchants |
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Proprietary Etchant Carrier
Medium - Eliminates Etchant Migration Through Vias |
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Sequential, Planar Layer
Removal with no Thermal or Mechanical Sample Damage |
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Controlled Etching of
silicone, oxides, nitrides, low k dielectrics, aluminium, copper |
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CE and SEMI S-2 Certification
in process
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