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SYSTEM
CONCEPT AND RATIONALE |
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Chemical De-layering of IC
samples has always been plagued by the diffusion of etch chemicals from
one metal layer to adjacent layers through interconnecting Vias.
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This contamination of adjacent
metal layers renders chemical etching not only difficult to control, but
irreproducible in terms of specific layer removal for subsequent test.
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Nisene Technology Group has
developed an automated IC De.Layering System that eliminates the
problems of adjacent layer contamination.
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We call this system. . . |
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