SUCCESSFUL CHEMICAL DE-LAYERING
PROTOCOLS FOR IC DIE TO DATE
•
g
NOMINAL STRUCTURE -
F
our / Six Metal (AI) die Stack
•
Passivation - Si
3
N
4
over SiO
2
•
g
Metal 6 - ARC-Ti/W-Al(Cu)-Ti/W
•
SiO
2
dielectric
•
g
Metal 4 - ARC-Ti/W-Al(Cu)-Ti/W
•
SiO
2
dielectric
•
Metal 3 - ARC-Ti/W-Al(Cu)-Ti/W etc.
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