Fancort is the industry leader in component lead preparation services for the Semiconductor and Aerospace industries. We have 40 years of experience in lead forming of a wide variety of packages, including large and small flat packs and quad packs, DIPs, fiberoptic headers and devices that require conversion from through-hole to SMT. We use our unique universal and dedicated tooling systems and complete process control to ensure accuracy and quick turnaround of your parts to JEDEC/IPC and/or mil-spec standard dimensions, with optional services such as package leak testing and tinning if required.

You are welcome to contact us to discuss the best and most economical application for your need or contact Fancort directly for deeper information of the tools.