2010 & 3010 DEMOUNTERS
The DYMATiX family of Demounters offers reliable, low-cost
solutions for the removal of die from sawn film frames. The
machines are user-friendly and require no mechanical
adjustments, which means the operator can run all die sizes with
only a single setup.
Operation of the machines is easy. The operator places the film
frame on the unit. The Demounter then separates the die from the
tape, spreading the die loosely on a removable tray, while still
maintaining the original orientation. This entire process takes
less than 30 seconds. The tray can then be taken to another area
for manual die sorting. Using several of these trays allows a
number of operators to sort die simultaneously.
The 1010D peels die as small as .070-inch square (1.75mm) from
wafers up to 200mm in diameter.
The 2010 peels die down to .020-inch square (.50mm) from wafers
up to 150mm in diameter. The 2010SD is equivalent to the 2010
with the added capablilty of peeling very small die of .010 inch
The DYMATiX Model 3010 Die Demounter can easily remove fully
sawn wafers from a film frame in less than thirty seconds. Die
as small as .030 inch square can be easily and quickly peeled
without any damage to the die.