 |
Tape
and Reel System |
 |
Manual Taping System
The TL-40 is a
full featured SMD taping system that is designed for low to mid volume
taping of virtually any type of component that can fit into embossed
carrier tape. The system can accommodate a wide range of tape size and
seal both heat sealable and pressure sensitive (PSA) cover tapes.
|
 |
ATP-7K Component
Taping System
A fully automatic, high
speed tube-fed SMD component taping system
The ATP-7K taping system is
a high speed, computer controlled unit designed to automatically place
and seal SMD components into EIA embossed tape from 8mm to 56mm wide.
Key features include:
• High
throughput up to 7,000 parts per hour
• Stack tube
feed holds up to 30 tubes (SOICs)
• Simple,
fast mechanical changes for different component
• Easy system
set-up via on screen menus/graphics
• Programmable
motor driven pick and place mechanism
• Full,
independent process control of each seal head for
temperature and pressure
• Optional
vision based lead and mark inspection with
automatic reject capability
|
 |
Component Detaper
Model ATP-7500
Fully automatic, high
speed SMD component detaping system (into tubes) for SO, TSSOP, SOJ and
other devices.
The ATP-7500 is a
state-of- the-art detaping system designed to remove SMT components from
EIA embossed tape from 8 - 44mm wide. |
|